374024B00035G

374024B00035G

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374024B00035G
散热片
Nuventix (BOYD)
HEATSINK BGA 23
-
散装
1


HEATSINK BGA 23X23X10MM W/ADH

产品参数
PDF(1)
类型描述
制造商Nuventix (BOYD)
系列-
包裹散装
产品状态ACTIVE
材料Aluminum
长度0.906" (23.01mm)
形状Square, Pin Fins
类型Top Mount
宽度0.906" (23.01mm)
封装冷却BGA
安装方法Thermal Tape, Adhesive (Included)
温升时的功耗1.0W @ 40°C
热阻@强制气流11.70°C/W @ 200 LFM
热阻@自然40.00°C/W
翅片高度0.394" (10.00mm)
材料表面处理Black Anodized

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