TLV3232QDGKRQ1

TLV3232QDGKRQ1

CLASSIFICATION

比较器

manufacturer

Texas Instruments

type

AUTOMOTIVE 20NS DUAL-CHANNEL COM

encapsulation

package

Cut Tape (CT)

RoHS

YES

price

available options

price inquiry

inventory：1600

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specifications

PDF(1)

Part Status

Active

Operating Temperature

-40°C ~ 125°C

Number of Elements

1

Mounting Type

Surface Mount

Grade

Automotive

Output Type

Push-Pull, Rail-to-Rail

Qualification

AEC-Q100

Package / Case

8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Supplier Device Package

8-VSSOP

Voltage - Supply, Single/Dual (±)

2.7V ~ 5.5V

Voltage - Input Offset (Max)

4mV @ 5V

Propagation Delay (Max)

25ns

Current - Quiescent (Max)

250µA

Current - Input Bias (Max)

0.01µA @ 5V

Hysteresis

3mV

Type

Standard (General Purpose)

Current - Output (Typ)

45mA @ 5V

CMRR, PSRR (Typ)

82dB CMRR, 92dB PSRR

86-755-23814471

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