SBB830-QTY25

SBB830-QTY25

  • image of Prototype Boards Perforated>SBB830-QTY25
  • image of Prototype Boards Perforated>SBB830-QTY25
SBB830-QTY25
Prototype Boards Perforated
Chip Quik, Inc.
830 PTS SOLDER-
-
Bulk
1
HSBB8008
华朔-HUASHUO
MOSFET


830 PTS SOLDER-IN BREADBOARD (EX

Product parameters
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesProto-Advantage
PackageBulk
Product StatusACTIVE
Size / Dimension6.60" L x 2.30" W (167.6mm x 58.4mm)
MaterialFR4 Epoxy Glass
Pitch0.1" (2.54mm) Grid
Board Thickness0.063" (1.60mm)
Proto Board TypeBreadboard, General Purpose
Hole Diameter0.039" (1.00mm)
Circuit Pattern5 Hole Pad (Single Side)
PlatingPlated Through Hole (PTH)

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