AGFB023R24C2E2V

AGFB023R24C2E2V

  • image of System On Chip (SoC)>AGFB023R24C2E2V
  • image of System On Chip (SoC)>AGFB023R24C2E2V
AGFB023R24C2E2V
System On Chip (SoC)
Intel
IC
-
Tray


IC

Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA

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