ADAU1860BCBZRL
56-BUMP WAFER LEVEL CHIP SCALE P
Basic Information
- Part Number:
- ADAU1860BCBZRL
- Encapsulation:
- -
- Package:
- Cut Tape (CT)
- Description:
- 56-BUMP WAFER LEVEL CHIP SCALE P
Product Parameters
| Operating Temperature | -40°C ~ 85°C |
|---|---|
| Part Status | Active |
| Mounting Type | Surface Mount |
| Sigma Delta | No |
| S/N Ratio, ADCs / DACs (db) Typ | - |
| Type | Audio |
| Resolution (Bits) | 24 b |
| Data Interface | I2C, I2S, SPI |
| Package / Case | 56-UFBGA, WLCSP |
| Voltage - Supply, Analog | 1.7V ~ 1.98V |
| Number of ADCs / DACs | 3 / 1 |
| Dynamic Range, ADCs / DACs (db) Typ | 110 / 130 |
| Voltage - Supply, tal | 0.85V ~ 1.21V |
| Supplier Device Package | 56-WLCSP (2.98x2.68) |